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[News] UNISOC and SmartSens Announce Strategic Push into Micro LED Optical Interconnects

On May 26, SmartSens Technology and UNISOC announced a strategic partnership to jointly advance high-speed Micro LED optical interconnect technology. The collaboration will focus on optical interconnect chip design and system-level solutions, targeting short-reach, high-speed connectivity for AI computing clusters with domestically developed solutions featuring high bandwidth, low power consumption, and high integration.

Under the partnership, both sides will develop a next-generation Micro LED CPO optical interconnect solution. Built on SmartSens’ optical sensing and Micro LED array technologies alongside UNISOC’s high-speed SerDes capabilities, the solution aims to enable efficient integration of optical engines and XPUs while balancing low power consumption, high bandwidth, and reliability. Target applications include AI data centers, intelligent driving assistance systems, and high-end industrial vision.

SmartSens, a key Chinese player in the CMOS image sensor (CIS) market, has in recent years expanded into emerging fields such as high-speed optical interconnects and edge AI under its “3+AI” strategy.

The company said its long-standing expertise in high-speed imaging, heterogeneous integration, micro-nano optical design, and high-speed circuit development provides a natural technological foundation for Micro LED optical interconnect R&D. In April, SmartSens disclosed the establishment of a dedicated business unit to advance integrated transceiver systems covering three core modules: TX driver arrays, PD detector arrays, and RX signal-processing arrays.

UNISOC, meanwhile, is one of China’s leading chip design companies, with deep expertise in AI processors and communications chips. Its products are widely used across smart devices, automotive electronics, and industrial control applications, supported by capabilities spanning chip design, large-scale production, and ecosystem integration.

SmartSens said the partnership will build on its established customer base in security, smartphones, automotive, and machine vision markets, combined with UNISOC’s ecosystem strengths in smart devices and edge AI. Looking ahead, the companies aim to accelerate application deployment and mass production of Micro LED optical interconnect solutions together with upstream and downstream partners.

(Photo credit: FREEPIK)

TrendForce 2026 Micro LED Display and Non-Display Application Market Analysis

Release: 30 September 2026

Format: PDF

Language: Traditional Chinese / English

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Release: 01 January 2026

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Page: 168

TrendForce AI Infra Bulletin
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