[News] Planar Engineers Groundbreaking New MIP (MicroLED in Package) Innovation and Architecture

Today, Planar, a global leader in visualization technology, introduced two cutting-edge engineering breakthroughs with the launch of Planar® EverPixel™ and Planar® TruMicro™ LED technologies. Unleashing the next evolution of display performance, both technologies are designed and manufactured with a proprietary process exclusively from Planar.

“Planar has long been a proven technology pioneer and has an unmatched history of bringing groundbreaking technologies to market,” said Sidney Rittenberg, Chief Executive Officer at Planar. “Today, this continues with the release of our new proprietary EverPixel and TruMicro technologies, driving the most advanced MIP development and delivering the next LED technology surpassing COB.”

First-of-its-Kind Production Process Yielding High-End Image Quality
Building on the MicroLED in Package (MIP) architecture and working in combination with Planar’s TruMicro, EverPixel technology eliminates the LED substrate and delivers manufacturing efficiency through fewer parts, processes and components. Exclusively from Planar, the technology doubles the number of red, green and blue (RGB) subpixels, providing a solution with built-in redundancy that effectively eliminates the concern of pixel outages and powers everlasting LED performance.

By soldering the chip electrode directly to the LED package, Planar delivers unmatched reliability, eliminating the risks of wire breakage or poor contact found in traditional gold and copper wire bonding. The light output surface eliminates metal occlusion to unlock five-sided light output. This drastically increases light efficiency and opens up ultra-wide viewing angles free from color distortion or dimming.

Revolutionary Pixel Technology Design Truly Micro in Size
The performance of Planar’s proprietary TruMicro LED technology exceeds that of any visual technology available today by introducing LED RGB subpixels that are remarkably smaller. Comprising MicroLED subpixels as small as 20 micrometers (μm), and reducing height and positioning the subpixels tightly together, TruMicro improves the uniformity of mixing and delicacy of color blending, nearly eliminating color separation or color shift concerns. It also enables enormously enhanced viewing angles.

Together, these innovations ensure optimal chip performance at the packaging level by mounting substrate-free, common-cathode RGB flip chips. Through advanced mass transfer soldering directly onto the packaging substrate, Planar achieves exceptional subpixel accuracy. By controlling chip offset to within 2μm, the spacing between subpixels is greatly reduced, resulting in a more seamless, high-resolution visual quality.

Planar’s TruMicro features the well-established, quality-control practice of binning LEDs. This process, which leverages a larger quantity of units and can continue to grow over time, achieves remarkable brightness and color uniformity.

Together, EverPixel and TruMicro technologies fit into an extremely small package with the capability to support pixel pitches smaller than 0.4 millimeters.

Planar’s proprietary EverPixel and TruMicro technologies will make their public debut at InfoComm 2026 in Booth #C7258 in Las Vegas June 17-19 with an innovative new product line that implements the groundbreaking technologies.

TrendForce 2026 Global LED Video Wall Market Outlook and Price Cost Analysis

Release Date: 30 September 2025

Language: Traditional Chinese / English

Format: PDF

Page: 288