[News] Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry

Veeco Instruments Inc., a global leader in semiconductor process equipment, today announced it has received multiple orders for its advanced wet processing and lithography systems from a leading specialist foundry. The systems will be deployed for advanced packaging and silicon photonics applications, supporting critical end markets including AI, automotive, aerospace and defense, and communications. Scheduled deliveries for the most recent orders will start in the first quarter of 2026.

“These new orders build on our legacy of collaboration with leading customers to deliver enabling technologies that drive innovation and meet the evolving demands of the semiconductor industry,” said Adrian Devasahayam, Senior Vice President, Product Line Management at Veeco. “These orders underscore Veeco’s position as a trusted partner for enabling next-generation device manufacturing in high-growth markets such as artificial intelligence, high-performance computing and silicon photonics. We remain committed to investing in new technologies and expanding our market reach through strategic partnerships and customer-driven innovation.”

Veeco’s WaferStorm®, WaferEtch® and AP300™ platforms were selected for their best-in-class process performance, unique capabilities, and low cost of ownership. Veeco’s WaferStorm® solvent cleaning systems set the industry standard for yield improvement, while WaferEtch® systems enable precise interconnect and device definition, for improved performance. The company’s lithography systems support next-generation advanced packaging processes, including copper (Cu) pillars for 2.5/3D packaging, flip-chip bumping, fan-out wafer-level packaging (FOWLP), and high-density fan-out packaging.

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Release: 01 January 2025

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